No.117  Special Issue on New Materials


December 2017

Contents

Preface

Technical Report

  1. 2.High-performance Bonding Wires for Semiconductor Packaging
    Tomohiro UNO, Tetsuya OYAMADA, Takashi YAMADA, Taizo ODA
    (PDF 2.9MB)Link to PDF Files<
  2. 3.Bonding Technique for Power Semiconductors Using Ni Nanoparticles
    Norie MATSUBARA, Tomohiro UNO, Masayuki CHIBA, Takayuki SHIMIZU
    (PDF 2.9MB)Link to PDF Files<
  3. 4.Development of Newly Advanced Metal Substrates for Catalytic Converters
    Toru INAGUMA, Shogo KONYA, Yasuhiro TSUMURA, Masafumi OMIZU, Shinji KAWASOE, Masayuki KASUYA
    (PDF 5.2MB)Link to PDF Files
  4. 5.Mechanical and Forming Properties of LAMINELITETM, Laminated Stainless Steel Foil for Battery Packaging
    Masaharu IBARAGI, Koichi NOSE, Hiroto UNNO, Naoki FUJIMOTO, Masahiro FUKUDA
    (PDF 3MB)Link to PDF Files
  5. 6.Fabrication of Planarized Stainless Steel Foil for Flexible Substrate
    Noriko YAMADA, Sawako YAMAGUCHI, Jun NAKATSUKA, Yoshiaki HAGIWARA, Yutaka SEKIGUCHI
    (PDF 3.4MB)Link to PDF Files
  6. 7.Development of New Reinforcement Method and 10T Magnetization of QMGTM Magnet
    Mitsuru MORITA, Hidekazu TESHIMA, Shinya NARIKI
    (PDF 5.3MB)Link to PDF Files
  7. 8.Spherical SiO2 Filler for Semiconductor Sealing Materials
    Yutaka SATO, Katsumasa YAGI, Mutsuhito TANAKA, Masanori AE, Syouzou TOKUDA
    (PDF 1.9MB)Link to PDF Files
  8. 9.Development of High Quality 4H-SiC Single Crystal Wafers Grown by Solution Growth Technique
    Kazuhiko KUSUNOKI, Kazuaki SEKI, Yutaka KISHIDA, Koji MORIGUCHI, Hiroshi KAIDO, Nobuhiro OKADA, Kazuhito KAMEI
    (PDF 2.9MB)Link to PDF Files
  9. 10.Computational Materials Science for Developing Sophisticated Top Seeded Solution Growth (TSSG) Processes of Single Crystalline SiC
    Koji MORIGUCHI, Nobuhiro OKADA, Hiroshi KAIDO, Yutaka KISHIDA, Kazuhiko KUSUNOKI, Kazuaki SEKI, Kazuhito KAMEI
    (PDF 5.3MB)Link to PDF Files

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